BondMaster 600 Composite Material Adhesive Testing Instrument

Overview:

BondMaster 600 Multi Mode Adhesive Tester

Simple and intuitive operation, high-quality performance

The BondMaster 600, a powerful detector, combines multi-mode adhesive testing software with ultra advanced digital electronic devices to provide users with extremely clear and stable high-quality signals. Whether it is detecting the adhesion of honeycomb structure composite materials, metal laminated materials, or laminated composite materials, users can use BondMaster 600 for extremely simple operations. This is not only due to the quick access keys and simplified interface equipped with the detector, but also the pre-set settings provided by the instrument for common applications facilitate the user's operation process. The user interface of BondMaster 600 has been improved, and its workflow has been simplified, allowing users of all levels to archive test results and create reports.

The BondMaster 600 handheld adhesive tester is equipped with a 5.7-inch VGA display screen. When converted to full screen mode, its enhanced resolution and brightness make the display on the screen brighter and clearer. No matter what display mode or detection method the user is currently using, simply clicking the full screen mode conversion button will activate the full screen mode. The BondMaster 600 adhesive tester is equipped with various standard testing methods, including one transmitter and one receiver RF, one transmitter and one receiver pulse, one transmitter and one receiver sweep frequency, resonance, and a significantly improved mechanical impedance analysis (MIA) method.

Compact and portable, extremely lightweight, in line with ergonomic requirements

The ergonomic design of BondMaster 600 enables users to easily detect difficult to reach detection areas. For testing conducted in extremely small spaces, using a wrist strap installed by the manufacturer not only provides users with great comfort during operation, but also allows them to always control the most important functions.

Verified on-site

The casing of the BondMaster 600 instrument is based on a field validated, sturdy and durable body design. As is well known, instruments with this body structure can operate normally under the harshest and most demanding testing conditions. The battery of BondMaster 600 instrument can provide long-term power supply, and its shell has sealing and waterproof properties. The corners of the instrument are equipped with highly wear-resistant protective sleeves, and the back panel is equipped with a dual function bracket/hanger. Therefore, it can be said that this instrument is a valuable tool for completing challenging testing applications.

Key Features

• Designed to meet IP66 requirements.

• Long term battery operation time (up to 9 hours).

• Compatible with existing BondMaster probes (PowerLink) and probes from other manufacturers.

• 5.7-inch bright color VGA display screen.

• Full screen options in all display modes.

• A pre-set intuitive interface with specialized applications.

• By using the RUN key, you can instantly switch between display modes.

• Newly added SCAN view function (sectional view).

• Newly added Spectrum view with new frequency tracking function.

• Gain adjustment function of shortcut access keys.

• All settings configuration pages.

• There are at most two real-time readings.

• Storage capacity up to 500 files (programs and data).

• Preview of onboard files.

There are two types of instruments available, which are highly flexible and compatible

BondMaster 600 comes in two models, suitable for different needs in composite material bonding testing. The basic model includes all one send one receive modes, while the B600M model provides users with all adhesive testing methods. Upgrading from the basic model of the instrument to a multi-mode model can be done remotely.

Both BondMaster 600 models are compatible with existing Olympus BondMaster probes, including those utilizing PowerLink technology. We also offer optional adapter cables to make the instrument compatible with probes produced by other manufacturers.

feature	B600 (Basic)	B600M (multi-mode)
Calibration of frozen signal	√	√
real-time reading	√	√
Application selection	√	√
Support for PowerLink probes	√	√
One send one receive RF and pulse modes	√	√
One send, one receive, sweep frequency	√	√
Mechanical Impedance Analysis (MIA) Mode		√
Resonant mode		√ (including cables)
Calibration menu (resonance and mechanical impedance analysis modes)		√

Interface:

Simplified interface, bright display

Complete application configuration immediately and access all settings directly

One of the main advantages of BondMaster 600 is its unprecedented ease of operation. The BondMaster 600 instrument combines innovative features from other Olympus products with multiple new features to develop a simple, user-friendly interface. These new features include a menu of application options (pre-set), direct modification of all settings on the screen, and the ability to calibrate signals in freeze mode.

All the advantages and features of the BondMaster 600 user interface can be expressed in up to 15 languages.

The application selection menu provides users with on-demand settings.

All settings screens display all parameters, allowing users to quickly edit them.

True full screen display and quick access method

The BondMaster 600 instrument is equipped with a complete set of shortcut access keys that allow users to make real-time adjustments to commonly used parameters, such as gain, full screen mode, display mode (RUN), and more. Eight bright and clear color screen settings can be used to display signals, enhancing the visibility of the screen under indoor and outdoor lighting conditions, thereby helping to reduce eye fatigue for operators.

A complete solution that includes detection and analysis, file archiving, and report production

Simplified workflow, convenient for users of all levels

The BondMaster 600 instrument provides users with an extremely simple and intuitive operating program for tracking and testing results. In order to facilitate the user's detection process from start to finish, the instrument has added some built-in features, such as high-capacity storage performance (up to 500 data and program files) and an onboard file preview function.

A typical workflow includes the following simple steps: saving the obtained results during the testing process, downloading the saved files to the new BondMaster PC viewing software, using the new "Export all files in PDF format" feature to immediately generate a complete testing report, and finally archiving the report if necessary.

１. detection

２. download

３. report

During the detection process, press the "Save" button at any time to record the observed signals.

Quickly download the results to BondMaster PC software via USB interface.

Just press one key to generate a complete report and archive the results as needed.

Detection mode:

The signal quality is unparalleled

Enhanced detection capability for honeycomb composite materials

In adhesive testing, a transmitting and receiving probe generates flexible flat waves and compression waves. When the signal passes through the tested workpiece, the amplitude changes between the probe transmitter and receiver are compared to detect debonding defects on the near and far sides. BondMaster 600 offers three options for one transmit one receive mode: RF (fixed frequency waveform), pulse (traditional view with envelope filter), or sweep (using different frequencies within the optional frequency range for scanning).

The one send one receive menu of BondMaster 600 has been optimized to enable users to quickly access the most frequently adjusted parameters during calibration and testing processes. Real time readings can provide immediate information on signal amplitude or phase, making it easier for users to interpret defects. The newly added automatic gate mode can automatically detect the optimal "gate" position based on radio frequency signals or pulse signals, thereby reducing operator errors and obtaining more results.

The one send one receive mode signal in the pulse display split screen. The X-Y view (on the right) displays records of proximal and distal debonding (in different phases).

OEM friendly: New frequency tracking tool for process development

The one send one receive sweep mode of BondMaster 600 not only improves signal quality, but also adds a new form of "spectrum" representation. This new view displays the real-time amplitude and phase of the signal relative to the frequency range. Two new frequency markers (known as frequency tracking) allow users to observe the signal situation of two specific frequencies, thus helping users choose the best detection parameters for a particular application. This newly added feature is an ideal tool for developing processes or creating new applications.

Spectrum view with frequency tracking function

Pre set resonance modes that meet user needs

Easily complete the testing of metal laminated bonding and laminated composite materials

The phase and amplitude changes of the internal divergent/standing waves in the resonant mode measurement probe. The resonant probe is a narrow bandwidth, contact probe, and the impedance changes of the probe chip are displayed in the X-Y view of BondMaster 600.

Resonant mode is a very simple and reliable method for detecting layered defects. Usually, the depth of layered defects can be estimated by the rotation of signal phase. The operation of the BondMaster 600 resonant mode is extremely simple, largely due to the manufacturer's pre-set configuration in the instrument designed for debonding applications of laminated composite materials and metal laminates.

Resonant mode, equipped with a "pass/fail" criterion.

Optimized user interface, simplified calibration program

The calibration process of BondMaster 600 resonant mode has been simplified into a few steps. Firstly, select the optimal operating frequency of the probe through the one-step calibration menu, and then use the BondMaster 600's concise and reasonable interface and the ability to calibrate by freezing signals to quickly and easily complete the final calibration.

After calibration is completed, users can easily track key signals in the image during the detection process using the improved reference signal and reference point system of BondMaster 600. In addition, the use of the reference point system is very flexible and convenient, allowing users to fine tune calibration without the need to re record points.

The calibration menu automatically selects the optimal operating frequency.

The improved reference point system of BondMaster 600.

Witness the powerful performance and accuracy of the Mechanical Impedance Analysis (MIA) mode

Detecting small area debonding in honeycomb composite materials

The adhesion testing mechanical impedance analysis (MIA) method can measure the mechanical impedance of materials, that is, the stiffness of materials. MIA's probe emits a fixed, audible frequency. The change in material stiffness is manifested as the variation in signal amplitude and phase in the X-Y view of BondMaster 600.

The small tip probe used in the mechanical impedance analysis mode, combined with the high-performance electronic device of BondMaster 600, makes the operation of detecting extremely small areas of debonding in honeycomb composite materials more convenient than other detection methods. In addition, BondMaster 600 expands the frequency range of mechanical impedance analysis (2 kHz to 50 kHz), allowing for maximum results, even for distal debonding defects.

The BondMaster 600 comes with a simple mechanical impedance analysis calibration guide that can guide users in selecting the optimal frequency when detecting small defects and other difficult to detect defects in honeycomb composite materials.

Mechanical impedance analysis mode with a new "scan" view and real-time readings.

The BondMaster 600 also displays real-time readings of signal amplitude or phase, and its new "scan" view allows users to monitor probe amplitude and phase on the timeline, which helps detect small debonding defects.

Identify repair areas (casting sealing areas) in honeycomb composite materials

Identifying repaired areas on an aircraft's rudder or fuselage can be seen as a challenging problem, especially after the repaired areas have been painted. By using certain detection methods, such as thermal infrared imaging, the repaired area may emit incorrect indications. However, using the Mechanical Impedance Analysis (MIA) mode for detection can solve this problem. Due to the fact that repair areas are generally harder, there will be significant differences in the mechanical impedance exhibited by the repair area compared to good areas or debonding areas.

The improved mechanical impedance analysis (MIA) mode of the BondMaster 600 instrument allows users to easily identify repair areas by simply analyzing the phase of the mechanical impedance analysis signal in the X-Y view.

Mechanical impedance analysis mode identifies the repair area (bottom signal) opposite to the debonding condition (surface signal).

Technical specifications:

Standard set of components

The standard configuration of BondMaster 600 is as follows:

Model:Basic type and multi-mode type (M).

power cordUp to 11 types of power cords (for DC adapters) are available.

Keypad and instruction labels:English, international symbols (icons), Chinese or Japanese.

Printing manual for 'Easy Beginner's Manual'Up to 9 language versions are available.

Items included in all BondMaster 600 models†: BondMaster 600 instrument with manufacturer installed wrist strap, "Easy Start Guide", calibration certificate, hard shell transport box, DC adapter with power cord, 67 Wh lithium-ion battery, AA battery box, USB communication cable, MicroSD memory card and adapter, one send one receive and mechanical impedance analysis probe cable, as well as BondMaster PC software and CD containing product manual.

The standard kit may vary depending on your location. To learn more about the situation, please contact your local dealer.

Only included in BondMaster 600M model: resonant probe cable.