High energy industrial CT/planar CT

High energy industrial CT
Industrial CT adopts advanced high-frequency constant voltage X-ray sources, digital imaging detectors, and high-precision mechanical detection platforms. Not only does it accurately reproduce the CT tomography and 3D images of the tested workpiece, but it also has real-time 2D imaging capabilities. The product has many advantages such as small size, fast detection speed, clear image, accurate detection, and high cost-effectiveness. The product is widely used in aerospace, aviation, military industry, machinery, casting IT、 Non destructive testing and measurement in industries such as automobiles.
Main functions
Multiple detection methods are used, including cone beam CT scanning and DR real-time imaging, to obtain a thousand slice tomographic image in one scan.
Multiple energy X-ray sources suitable for different inspection workpieces.
Multiple detectors can be selected for imaging methods.
● It has the functions of defect and pore analysis, as well as defining the area of the tested workpiece.
Use different colors to identify and detect defect volume, location, and size.
Analyze defect size statistics, calculate the total percentage of pores, and create a histogram of pore volume.
Analyze wall thickness: Mark the analysis results with different colors.
Measurement tools: measure parameters such as workpiece position, distance, radius, angle, etc.
Reverse engineering CAD design and physical comparison.
Accurate measurement of the internal dimensions of the tested workpiece can be achieved.
Main technical parameters
● Tube voltage: 20-450kV
● Focus size: 1 micron to 0.4 millimeters
● Spatial resolution: 0.5 micrometers
Density resolution: 0.3~0.5%
● Scanning method: Cone beam scanning
● Detector: Digital flat panel detector or image intensifier
Image reconstruction speed: 1024X1024 pixel image takes only 0.2 seconds

Flat CT
Flat CT is a specialized tool for detecting the internal quality status and structural information of plate-like structures, which can be used on PCB boards, BGA、 Quality assessment and analysis of high-resolution imaging of plate-like structures such as integrated chips. Reconstruct three-dimensional tomographic images of the scanning area to achieve spatial localization of manufacturing defects in plate-like structure detection devices and plate-like electrical devices, and realize CAD design of plate-like electrical components and component circuit diagrams.
Main technical parameters
● Tube voltage: 20-225kv
● Focus size: 1 micron~5 microns
● Spatial resolution: 0.6~50 μ m
Density resolution: 0.3~0.5%
● Scanning method: Cone beam scanning
● Detector: Digital tablet controller