Cold inlaid resin

NegotiableUpdate on 12/20

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

1、 Introduction: Low viscosity epoxy inlay material is a fast curing epoxy resin inlay material with particularly low viscosity; Cold inlay material has good transparency after hardening; Composed of two components: resin and curing agent, both in liquid form; The important characteristics of this material are low viscosity and excellent fluidity, which fills the pores and cracks in the sample with resin. It is suitable for the electronics industry and gap samples. 2、 Technical parameters: 500g resin, 250g curing agent for hardening

Product Details

No heating, no pressure, no inlay machine required inlay material! Suitable for inlaying and non inlaying places where samples cannot be heated, saving equipment investment and energy consumption, while also not worrying about sample softening due to high inlaying temperature tempering and internal structural changes caused by heating.

Especially suitable for embedding micro slice samples in the electronics industry.

	CM1 Cold Inlay King Packaging: (small package) 500g powder+400ml liquid (Large package) 1000g powder+800ml liquid Attachment: 1 Ø 30 cold embedding mold+40 plastic cups and mixing rods each+1 spoon Acrylic series, semi transparent. Curing time: 25 ℃ for 25 minutes Belonging to the acrylic series, it has fast inlaying speed and high strength. Suitable for the metal processing industry.
	CM1SE Cold Inlay King Packaging: (large package) 1000g powder+800ml liquid Attachment: 1 Ø 30 cold embedding mold+40 plastic cups and mixing rods each+1 spoon Acrylic series, fully transparent. Curing time: 15 minutes at 25 ℃ Belonging to the acrylic series, it has fast inlaying speed and high strength. Suitable for the metal processing industry.
	CM2 Crystal King Packaging: 1000ml liquid resin+50ml curing agent Attachment: 1 Ø 30 cold embedding mold+40 plastic cups and 40 mixing rods each Transparent as crystal. Curing time: 25 ℃ for 30 minutes Suitable for various materials, especially in the electronic industry such as PCB and SMT.
	CM3 Quick Epoxy King (Quick Drying Type) Packaging: (small package) 1000ml liquid resin+500ml curing agent (Large packaging) 4L liquid resin+1200ml curing agent Attachment: 1 Ø 30 cold embedding mold+40 plastic cups and 40 mixing rods each Epoxy resin, fast curing, completely transparent, odorless. Curing time: 25 ℃ for 40 minutes Suitable for various materials, especially in the electronic industry such as PCB and SMT.
	CM4 low viscosity epoxy king Packaging: (small package) 1000ml liquid resin+300ml curing agent (Large packaging) Resin 4000ml liquid+1200ml curing agent Attachment: 1 Ø 30 cold embedding mold+40 plastic cups and mixing rods each made of epoxy resin, with extremely low viscosity, good permeability, completely transparent, and odorless. Curing time: 3-4 hours at 25 ℃ Suitable for various materials, especially in the electronic industry such as PCB and SMT.
	CM6 Low Heat Epoxy King Packaging: 4L resin liquid/bottle+1200ml curing agent Attachment: 1 Ø 30 cold embedding mold+40 plastic cups and 40 mixing rods each Epoxy resin, with minimal shrinkage, low heat generation, completely transparent, and odorless. Curing time: 25 ℃ for 20-24 hours Suitable for various materials, especially in the electronic industry such as PCB and SMT.
	CM7 UV curable resin Components: 1000ml liquid+100ml multi-layer varnish+4g repair paste Only cured under blue light irradiation, without harmful ultraviolet rays All resins are used in composites without the need for special mixing Extended storage time as aggregation only occurs under blue light By using appropriate radiation methods, the temperature can be lowered to about 50 ℃ or lower Bubble free transparent composite that can resist alcohol and acid Suitable for scanning electron microscopy testing, odorless